As todays rapidly evolving technology for wafering silicon and sapphire moves from loose abrasive sawing to fixed abrasive sawing,

diamond has emerged as the abrasive of choice for delivering maximum performance in fixed diamond wire products.

In these technically demanding applications, diamond is typically attached to thin precision steel wire using an electroplated nickel or

resin bonding agent.


Benewtec has developed a variety of highly engineered diamond wire sawing for applications used in the wafering,

blocking, cropping and bricking of sapphire and silicon.

Our proprietary manufacturing processes ensure the highest level of quality and consistency through precise control of critical parameters,

including: size and distribution (PSD), shape/aspect ratio, coating thickness, and surface coverage.