The company can provide 3oz-14oz ( thickness 105μm-500μm ) ultra-low profile with high temperature ductility thick copper foil 

( VLP-HTE-HF ). the product is sheet-like with a maximum specification of 1295 * 1295 mm. the ultra-low profile high temperature 

ductility thick copper not only has the excellent physical characteristics of equiaxed crystallization, low profile, high strength and

high elongation, but also has the PCB manufacturing performance of high peel strength, no copper powder transfer and clear pattern. 

it is suitable for lining copper sleeve, with superior conductivity, and can replace aluminum substrate. 

It is suitable for manufacturing of "high current PCB" for high power circuits such as electric power and automobiles.